Yeonsu Kim

M.S. Student in KAIST HCIL (Advisor: Geehyuk Lee)

Interested in making the privilege I enjoyed no longer a privilege, but a right of everyone.

Always open to having a free talk :) Love to talk about any kinds of interesting ideas!


Research Interests: HCI, AR/VR, Wearable Technology, Accessibility

| yeonsu.kim@kaist.ac.kr | CV (Dec 2020) | Google Scholar | Twitter |

Latest News

Feb 2021 | Paper Accepted at IEEE TMC

Dec 2020 | Paper Accepted at ACM CHI 2021. 🏆 Honorable Mention Award

Nov 2020 | Engineering Innovator Award (KAIST College of Engineering)

Aug 2020 | Started M.S. Student at School of Computing, KAIST (Advisor: Geehyuk Lee)

Aug 2020 | Earned B.S. School of Computing, KAIST

Publications

ThroughHand: 2D Tactile Interaction to Simultaneously Recognize and Touch Multiple Objects
Jingun Jung, Sunmin Son, Sangyoon Lee, Yeonsu Kim, and Geehyuk Lee.
ACM CHI 2021. 🏆 Honorable Mention Award
| Paper | Video |

Adapting to Unknown Conditions in Learning-based Mobile Sensing
Taesik Gong, Yeonsu Kim, Ryuhaerang Choi, Jinwoo Shin, and Sung-Ju Lee.
IEEE TMC.
| Paper |

MetaSense: Few-Shot Adaptation to Untrained Conditions in Deep Mobile Sensing
Taesik Gong, Yeonsu Kim, Jinwoo Shin, and Sung-Ju Lee.
ACM SenSys 2019.
|
Paper | WebSite | Video |

Towards Condition-Independent Deep Mobile Sensing
Taesik Gong,
Yeonsu Kim, Jinwoo Shin, and Sung-Ju Lee.
ACM MobiSys 2019 Poster.
|
Poster | ACM DL |

Awards

Honorable Mention Award, ACM CHI 2021
Title: "ThroughHand: 2D Tactile Interaction to Simultaneously Recognize and Touch Multiple Objects"

Engineering Innovator Award, KAIST College of Engineering
Awarded by Dean of KAIST College of Engineering

Student Travel Grant, ACM SIGMOBILE
Awarded ACM SenSys/BuildSys19 Student Travel Grant by SIGMOBILE ($1,000)

Undergraduate Research Program, KAIST
Excellent Award at KAIST Undergraduate Research Program ($1,500)


Projects

ThroughHand